Package and thermal: 16-WSON with exposed pad
Housed in a 16-WFDFN exposed-pad package (supplier device package 16-WSON, 5x4 mm), the part relies on the exposed paddle soldered to a copper land on the PCB to dissipate heat. The 0.50 mm pitch of the WSON package is manageable with a 4-layer board; two-layer designs need careful fan-out of the exposed-pad connection.
