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Texas Instruments LM3205TL/NOPB — Discrete Semiconductors

Texas Instruments LM3205TL/NOPB Step-Down Buck, 650 mA

MPNLM3205TL/NOPB
End of Life

Texas Instruments LM3205TL/NOPB step-down buck regulator, 650 mA output, 2 MHz switching, adjustable output 0.8-3.6 V, 8-WFBGA/DSBGA surface-mount package, bulk.

$2.0Ref. price · indicative, final on quote
Packaging8-WFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LM3205TL/NOPB specifications
ParameterValue
Output typeAdjustable
MountingSurface Mount
Voltage - input5.5V
Voltage - output3.6V
Voltage - output (Min (Fixed))0.8V
Output current650mA
Frequency - switching2MHz
I/O channels1
Operating temperature-30°C ~ 85°C (TA)
PackageBulk
FunctionStep-Down
TopologyBuck
Case8-WFBGA, DSBGA
Output configurationPositive
Synchronous rectifierYes

Product details

Step-down regulator in a 2x1.3 mm DSBGA

The LM3205TL/NOPB is a 650 mA adjustable step-down (buck) converter from Texas Instruments, switching at 2 MHz and packaged in an 8-bump DSBGA measuring 2x1.3 mm. The synchronous rectifier eliminates the external Schottky diode, saving board area and improving efficiency at light loads — a practical advantage when every mm² counts in a wearable or IoT node.

Switching frequency and thermal envelope

Operating temperature spans -30 °C to 85 °C — this is the commercial/industrial band, not automotive. The DSBGA's thermal resistance depends heavily on PCB copper area; the 650 mA rating assumes adequate board-level heat spreading. At 650 mA continuous output, the internal switch's Rds(on) at junction temperature determines the conduction loss — the 2 MHz switching adds AC losses from gate charge and output capacitance, so the total efficiency peaks in the 200-400 mA range for typical 3.3 V to 1.8 V conversions.

The 8-WFBGA, DSBGA package with a 2x1.3 mm footprint is a wafer-level chip-scale package — the bumps are the I/O. The 0.5 mm pitch demands a PCB with at least two layers for fan-out; the centre bump is the thermal pad and should be stitched to the ground plane with multiple vias.

Lifecycle and compliance

As a TI-branded device, the datasheet, application notes, and IBIS models are available from the manufacturer's product page.

Frequently asked questions

What package does the LM3205TL/NOPB use and how does it mount?

It uses an 8-bump WFBGA/DSBGA package with a 2x1.3 mm body, surface-mount. The bumps are the only electrical and thermal connections; the centre bump should be connected to the PCB ground plane with multiple thermal vias.