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Texas Instruments CSD17484F4

CSD17484F4 N-Channel MOSFET, 30V 3A, FemtoFET™, 3-PICOSTAR

MPNCSD17484F4
End of Life

Texas Instruments FemtoFET™ series, CSD17484F4, N-Channel MOSFET, 30V Vdss, 3A Id, 121mOhm Rds(on) @ 500mA/8V, 1.2nC Qg, 3-PICOSTAR surface mount, -55°C to 150°C.

$0.48Ref. price · indicative, final on quote
Packaging3-XFDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CSD17484F4 Technical Specifications
ParameterValue
SeriesFemtoFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)1.8V, 8V
Current - continuous drain (Id) @ 25°C3A (Ta)
Power dissipation500mW (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs12V
TechnologyMOSFET (Metal Oxide)
Case3-XFDFN
Vgs(th) (Max) @ id1.1V @ 250µA
Rds on (Max) @ id, vgs121mOhm @ 500mA, 8V
Gate charge (Qg) (Max) @ vgs1.2 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds195 pF @ 15 V

Product details

Rds(on) and package power — the derating reality

At 3 A, the 121 mOhm Rds(on) produces conduction loss above the 500 mW package power dissipation rating. Continuous 3 A requires aggressive thermal management or pulsed operation.

Sourcing and lifecycle

The CSD17484F4 is listed as Active in production and ROHS3 compliant. No official second source or pin-compatible cross is listed in the TI FemtoFET™ family; the 3-PICOSTAR footprint is unique to this series.

Frequently asked questions

What is the closest pin-compatible alternative to CSD17484F4?

No official pin-compatible cross or second source is listed in the TI FemtoFET™ family. The 3-PICOSTAR footprint is specific to this series; any alternative would require a board layout change.