CR16C core, 224-ball BGA — what this connectivity processor brings to the board
The CP3SP33SMS/NOPB is a CR16C-based connectivity processor from the CP3000 series, built for bridging multiple wired and wireless interfaces in embedded systems. It runs on a 3V to 3.3V supply and operates from -40°C to 85°C, making it suitable for industrial-temperature environments. Program memory is external — there is no on-chip flash — so the firmware lives on a separate SPI NOR or parallel EBI/EMI device, and the 44K x 8 RAM serves as scratchpad and data buffer.
Interface breadth and I/O count
With 64 I/O lines and interfaces spanning ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I²S, Microwire/SPI, UART/USART, and USB OTG, this part can act as a central bridge between a host processor and a mix of sensors, displays, and wireless modules. The 224-NFBGA (13x13 mm) package is a fine-pitch BGA — not hand-solderable in a home shop, but standard for reflow assembly in production.