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Texas Instruments CD74HCT365M — Logic ICs

CD74HCT365M 74HCT Buffer, Non-Inverting, 3-State, 16-SOIC

MPNCD74HCT365M
End of Life

Texas Instruments 74HCT series, CD74HCT365M, Buffer Non-Inverting, 3-State, 1 element, 6 bits per element, 4mA output, 4.5V to 5.5V supply, Surface Mount 16-SOIC, -55°C to 125°C.

$1.34Ref. price · indicative, final on quote
Packaging16-SOIC (0.154", 3.90mm Width)
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CD74HCT365M Technical Specifications
ParameterValue
Series74HCT
Logic typeBuffer, Non-Inverting
Output type3-State
Mounting typeSurface Mount
Voltage4.5V ~ 5.5V
Current - output high, low4mA, 4mA
Operating temperature-55°C ~ 125°C (TA)
PackageTube
Case16-SOIC (0.154\", 3.90mm Width)
Number of elements1
Number of bits per element6

Product details

What this 74HCT buffer does on the board

The CD74HCT365M is a single-element, six-bit, non-inverting buffer with 3-state outputs from the 74HCT logic family. It takes a 5V supply rail (4.5V to 5.5V) and presents a familiar TTL-compatible input threshold while running on CMOS power. The 3-state outputs let you share a bus line with other drivers — pull the output-enable high and the pins go high-impedance, effectively disconnecting the part from the bus without fighting other signals. It comes in a 16-pin SOIC package (3.90mm body width) for surface-mount assembly — the same footprint as a standard SO-16, so it swaps into existing layouts without a board spin.

Frequently asked questions

What is the difference between CD74HCT365M and CD74HCT365?

The 'M' suffix typically indicates the surface-mount SOIC package variant (16-SOIC). The base CD74HCT365 without the suffix is often the through-hole DIP version. Both share the same logic function and electrical specifications, but the package and mounting method differ.