Texas Instruments CD74HC373E — Microcontrollers & Processors (MCU / MPU / DSP)
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Texas Instruments / Microcontrollers & Processors (MCU / MPU / DSP)

CD74HC373E 74HC D-Type Transparent Latch, 8:8, Tri-State

MPN CD74HC373E
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Texas Instruments 74HC series CD74HC373E D-Type Transparent Latch, Octal 8:8, Tri-State Outputs, Through Hole 20-DIP (0.300", 7.62mm), 2V-6V Supply.

In Stock: 3,543 pcs
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[SPEC] Essential Parameters Snapshot Full Specifications (12)
Package / Case 20-DIP (0.300", 7.62mm)
Supply Voltage 2V ~ 6V
Output / Current 7.8mA, 7.8mA

Full Technical Specifications

12 Parameters
CD74HC373E specifications
Parameter / AttributeSpecification / Value
Series74HC
Logic typeD-Type Transparent Latch
Output typeTri-State
MountingThrough Hole
Supply voltage2V ~ 6V
Current - output high, low7.8mA, 7.8mA
Operating temperature-55°C ~ 125°C
Circuit8:8
PackageTube
Case20-DIP (0.300\", 7.62mm)
Independent circuits1
Delay time - propagation30ns
Series Sibling Variants

Texas Instruments 74HC Series Models

Sibling variants, package options, and speed/density grades in this Texas Instruments semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

Octal transparent latch with tri-state bus control

The CD74HC373E is an octal D-type transparent latch from the 74HC series, configured as 8:8 with tri-state outputs. When the latch-enable (LE) input is high, the Q outputs follow the D inputs; when LE goes low, the last data state is latched. The output-enable (OE) pin places the eight outputs in a high-impedance state for bus-oriented systems. Supply voltage spans 2V to 6V, covering the full 74HC operating range. Propagation delay is 30ns typical — this sets the data-to-output settling time. For a bus operating at 10 MHz, the 30ns delay consumes 30% of the 100ns cycle, leaving 70ns for setup and hold at the receiver. The 7.8mA output high/low drive is sufficient for driving one or two standard TTL loads but not heavily loaded backplanes.

20-pin DIP package and board integration

Housed in a 20-DIP (0.300", 7.62mm) through-hole package with the supplier device package designated 20-PDIP. The 0.100-inch pin pitch and 0.300-inch row spacing are standard for breadboard prototyping and socketed designs. No special soldering profile beyond conventional wave or hand-solder — the DIP body tolerates 260°C peak for 10 seconds per JEDEC. The through-hole format simplifies rework and field replacement compared to surface-mount equivalents. A standard DIP socket or soldered through-hole connection provides mechanical retention under vibration without additional hardware.

Frequently asked questions

What is the closest functional second-source to the CD74HC373E?

The 74FCT573APC is a functional peer — also an octal D-type transparent latch with tri-state outputs in a through-hole package. The pinout is not guaranteed identical — verify the pin assignment against your PCB before substituting.

Will CD74HC373E drop into a board originally specified for 74FCT573APC?

Both parts are 20-pin DIP octal transparent latches with tri-state outputs, but the supply voltage range differs (2V-6V for the CD74HC373E vs 4.75V for the 74FCT573APC). The CD74HC373E operates at 5V and is functionally compatible at that rail, but the 30ns propagation delay is slower than the 8.5ns of the 74FCT573APC. Timing closure at the system level must be re-evaluated. Pin compatibility should be confirmed against the specific PCB footprint — the standard 20-pin DIP layout is common but not guaranteed identical across manufacturers.

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