16-VQFN footprint and thermal story
The BQ76PL102RGTT: The exposed pad on the underside is the primary thermal path — a thermal via array under the pad, tied to the ground plane, pulls heat from the die into the board copper. The 3x3 mm footprint and 0.50 mm pitch demand a solder stencil aperture that covers at least 50% of the pad area for reliable void-free reflow. A no-clean flux residue under the pad can lift the thermal resistance by 20% or more.
Cell-count and chemistry scope
This multi-function controller handles 1 to 2 series-connected lithium-ion cells, with the battery chemistry explicitly listed as Lithium Ion. The undervoltage fault protection triggers a shutdown when any cell drops below the programmed threshold — the exact threshold is set by external resistor dividers, not hard-coded. The SMBus interface lets a host microcontroller read cell voltages, fault flags, and status registers over a two-wire bus. The bus pull-up resistors must be sized for the 400 kHz max clock rate; a 10 kΩ pull-up to 3.3 V gives adequate rise time for a bus capacitance under 200 pF.
Temperature grade and environment
The 85°C ceiling means the die temperature at full load stays below the silicon junction limit when the board copper area under the exposed pad is at least 1 in² per the TI thermal application note. The -40°C low end covers cold-crank scenarios in automotive auxiliary battery packs and outdoor energy-storage enclosures. The undervoltage lockout hysteresis widens at low temperature — a cold cell that dips below threshold will not re-enable until the voltage recovers by roughly 200 mV.
The series identity is PowerLAN™ and PowerPump™, TI's proprietary communication and cell-balancing protocol families. The packaging options are Tape & Reel (TR) for reel quantities and Cut Tape (CT) for smaller engineering samples. A sealed reel with consistent date codes across the full quantity is the standard procurement unit; mixed-date reels from surplus channels should be inspected for traceability back to a single TI production lot.