BQ294704DSGT

Texas Instruments

Texas Instruments BQ294704DSGT battery protection IC, Li-Ion 2-4 cell, over-voltage fault protection, 8-WFDFN exposed pad, surface mount, -40°C to 110°C.

Texas Instruments BQ294704DSGT
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[IN STOCK] In Stock: 35 pcs
$0.63/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BQ294704DSGT specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Operating temperature-40°C ~ 110°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionBattery Protection
Case8-WFDFN Exposed Pad
Number of cells2 ~ 4
Fault protectionOver Voltage
Battery chemistryLithium Ion

Technical details

Battery protection IC for 2-4 cell Li-Ion packs

The Texas Instruments BQ294704DSGT is a battery protection IC designed for Lithium-Ion packs with 2 to 4 series cells. Its primary function is over-voltage fault protection — it monitors each cell voltage and triggers a shutdown when any cell exceeds the over-voltage threshold, preventing cell damage or thermal runaway. Housed in an 8-WFDFN exposed pad package (supplier device package 8-WSON 2x2 mm), it is a surface-mount component suited for compact battery management system (BMS) PCBs where board space is tight.

Active production — no LTB window to track

For a procurement desk, this means no urgency to stockpile or scramble for end-of-life inventory. The part can be specified into new designs without worrying about an imminent EOL notice.

Over-voltage protection — what the fault trigger means on the bench

The BQ294704DSGT monitors each series cell in a 2-to-4-cell Li-Ion stack. When any cell voltage exceeds the factory-set over-voltage threshold, the IC asserts a fault output that can drive an external FET to disconnect the pack from the charger or load. This is the primary protection mechanism against over-charge, which is the dominant failure mode in Li-Ion packs. The 110°C upper limit is above typical Li-Ion cell operating temperatures (usually 60-85°C), so the IC itself is not the thermal bottleneck in the BMS design.

The 8-WFDFN exposed pad package (8-WSON, 2x2 mm body) requires a thermal pad on the PCB for adequate heat dissipation. The exposed pad is typically connected to the ground plane. The 0.5 mm pitch is fine-pitch but hand-solderable with a hot-air rework station — the pad geometry is standard for this package class.

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