15-DSBGA footprint and board-fit
The BQ27425YZFR-G1 ships in a 15-bump DSBGA (15-UFBGA) package — 0.5 mm pitch, no exposed thermal pad. The bottom-side bumps are the only electrical and thermal path; the board layout must route all signals under the package without vias in the pad area, and the copper pour under the die should connect to the ground plane for heat spreading. Surface-mount assembly with standard lead-free reflow profile per JEDEC J-STD-020. The package is moisture-sensitive — bake before reflow if the floor life has been exceeded.
Monitoring a single LiCoO₂ cell over I²C
This is a single-cell (1-series) battery monitor for Lithium Cobalt Oxide chemistry — the Impedance Track™ algorithm tracks state-of-charge and state-of-health by measuring cell voltage, current, and temperature. The I²C interface reports the data to a host MCU at up to 400 kHz.