BQ25970YFFR

Texas Instruments

Texas Instruments BQ25970YFFR multi-chemistry battery charger IC, 8A max charge current, I²C interface, 56-DSBGA (3.33x2.93) package, surface mount, -40°C to 85°C operating temperature.

Texas Instruments BQ25970YFFR
Download datasheet (PDF)
[IN STOCK] In Stock: 1,625 pcs
$7.49/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BQ25970YFFR specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Battery pack voltage4.65V (Max)
Supply voltage12V
Charge current - max8A
InterfaceI²C
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case56-UFBGA, DSBGA
Number of cells1
Fault protectionOver Current, Over Voltage
Battery chemistryMulti-Chemistry

Technical details

8A charge current, 1-cell multi-chemistry charger in 56-DSBGA

It targets fast-charge applications in portable electronics, power tools, and compact medical devices where charge time drives the BOM. The I²C interface allows the system host to program charge voltage, current, and termination thresholds, and to read fault flags.

12V supply ceiling and 4.65V pack voltage

Maximum supply voltage is 12V, so the input rail must be regulated below that — a 5V or 9V USB-C source works directly, but a 12V adapter needs a pre-regulator or OVP clamp. The battery pack voltage tops out at 4.65V, which suits 1-cell Li-ion or Li-polymer with a 4.4V or 4.45V termination ceiling, as well as LiFePO4 cells at their 3.65V float. Over-current and over-voltage fault protection are integrated, so external protection FETs can be minimal.

56-DSBGA — fine-pitch BGA layout considerations

The 56-DSBGA package measures 3.33x2.93 mm with 0.5 mm or finer ball pitch (typical for DSBGA). This demands a 4-layer PCB minimum for fan-out, with micro-vias or via-in-pad for the inner rows.

For production planning, this means no imminent last-time-buy risk and no forced redesign.

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