Package and thermal considerations
The 24-WQFN (4x4 mm) with exposed pad requires a thermal land on the PCB to dissipate heat during high-current charging. The pad must be soldered to a copper plane; a via array under the pad improves thermal transfer. The part is specified for surface-mount assembly only — no through-hole option.
Lifecycle and compliance
The BQ25616RTWT carries an active lifecycle status and is ROHS3 compliant. For new designs, this part is a current-production choice with standard lead times through distribution.
