It delivers a constant charge current up to 3A from a supply voltage up to 13.5V, making it suited for portable devices, power banks, and IoT endpoints that need fast charging from USB or adapter inputs. The I²C interface allows the system to program the charge current dynamically, enabling thermal regulation or adaptive charging profiles. Integrated fault protection covers over-current, over-temperature, and over-voltage conditions, reducing external component count.
Package and rework considerations for the 30-DSBGA
The 30-DSBGA is a fine-pitch wafer-level package with no leads — orientation marks are small, so verify pin 1 location under magnification before placement. Hot-air rework is possible with a preheat plate at 150°C and a fine nozzle, but the small ball pitch makes alignment tricky; a stencil and reflow oven give better yield.
Lifecycle and sourcing status
ROHS3 compliant.