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Texas Instruments BQ25600DYFFT — Power Management (PMIC / Gate Driver)

BQ25600DYFFT Battery Charger IC, 3A Li-Ion, I²C, 30-DSBGA

MPNBQ25600DYFFT
Active

Texas Instruments BQ25600DYFFT, 1-cell Li-Ion/Polymer battery charger IC, 3A max charge current, I²C interface, 30-UFBGA/DSBGA package, -40°C to 85°C operating temperature, active production.

$4.2300Ref. price · indicative, final on quote
Packaging30-UFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BQ25600DYFFT specifications
ParameterValue
MountingSurface Mount
Battery pack voltage4.62V (Max)
Supply voltage13.5V
Current - chargingConstant
Charge current - max3A
InterfaceI²C
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case30-UFBGA, DSBGA
Number of cells1
Fault protectionOver Current, Over Temperature, Over Voltage
Battery chemistryLithium Ion/Polymer
Programmable featuresCurrent

Product details

What this charger IC brings to a single-cell Li-Ion BOM

The Texas Instruments BQ25600DYFFT is a 1-cell Li-Ion/Polymer battery charger IC in a 30-bump DSBGA package. It handles a constant charge current up to 3A from an input supply rated to 13.5V, which covers USB, 5V adapters, and 12V rails with margin. The I²C interface lets firmware set the charge current dynamically — useful for throttling back under thermal constraints or matching a smaller cell's C-rate. Over-voltage, over-current, and over-temperature fault protection are built in, so the BOM doesn't need a separate supervisor IC for basic safety compliance.

At 3A charge current, the input power draw at the 13.5V max supply is roughly 40W before conversion losses. That sets the thermal design constraint: the DSBGA package relies on the PCB copper for heat spreading. The constant-current profile is straightforward for a firmware engineer — write the target current to the register and monitor the fault flags.

Package and layout: 30-DSBGA

The 30-DSBGA (0.4 mm pitch typical) is a wafer-level chip-scale package. It requires a solder-paste stencil designed for the bump pattern and a reflow profile that follows the JEDEC moisture sensitivity level for the part. No exposed thermal pad — all heat sinks through the bumps into the board copper. The surface-mount assembly is standard for a pick-and-place line, but rework with a hot-air station is risky on a 0.4 mm pitch BGA; a pre-bake per MSL recommendations is mandatory if the reel has been opened past the floor-life window.

The base product number is BQ25600, so the 'DYFFT' suffix identifies the 30-DSBGA package and the tape-and-reel / cut-tape shipping options.

Frequently asked questions

Does BQ25600DYFFT have overvoltage protection?

Yes, the fault protection block includes over-voltage, over-current, and over-temperature protection, covering the main failure modes for a single-cell Li-Ion charger.

What is the maximum charge current of BQ25600DYFFT?

The maximum charge current is 3A, with constant-current charging and I²C-programmable current setting.

Is BQ25600DYFFT equivalent to BQ25600?

BQ25600DYFFT is a specific package and reel variant of the base BQ25600 device. The 'DYFFT' suffix denotes the 30-DSBGA package and Tape & Reel / Cut Tape shipping format. The die and electrical specifications are the same as the base product number.