25-DSBGA footprint and board integration
The BQ25123YFPR ships in a 25-XFBGA, DSBGA package (2.53 x 2.47 mm body per the supplier device package designation). The 0.4 mm ball pitch typical of this package class demands a controlled impedance PCB stack-up and a solder mask defined pad geometry — the land pattern in the TI application note must be followed to avoid head-in-pillow defects on the fine-pitch balls. The 25-DSBGA has no exposed thermal pad; heat dissipation relies on the copper plane on layer 2 under the package. A 2-layer board with a solid ground plane under the BGA is the minimum thermal solution for the 300 mA charge current at high ambient.
I²C-programmable charge engine with integrated fault protection
This is a single-cell linear charger for Li-Ion or Li-Polymer packs, with a maximum charge current of 300 mA and a battery pack voltage ceiling of 5.5 V. The charge current, termination timer, and regulation voltage are all set over the I²C interface — no external resistor divider for the current setpoint, which saves two passives per BOM line. The 20 V maximum supply input covers USB-C VBUS (5 V nominal) and common 5 V wall adapters with margin for hot-plug transients. The integrated over-voltage, over-current, over-temperature, and short-circuit protection means the charger can be placed directly at the input connector without a separate TVS diode for most portable designs.
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