250 mA linear charger in a 6-ball DSBGA
The part integrates over-temperature, over-voltage, and short-circuit protection — three fault monitors that cover the common failure modes in a portable charge path.
The BQ25100HYFPT comes in a 6-ball DSBGA (6-XFBGA) package, 0.4 mm pitch, no leads exposed — it's a wafer-level chip-scale package. The pad layout is the same as the supplier device package 6-DSBGA. Surface-mount only; the small ball array means the PCB fan-out is straightforward on a two-layer board, but the 0.4 mm pitch demands a solder-paste stencil with 0.2 mm apertures and a reflow profile that stays below 260 °C peak. Under a hot-air station, the part lifts cleanly if the board is preheated to 100 °C — the low thermal mass of the DSBGA means it reflows fast, so watch the soak time to avoid cold joints on the outer balls.