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Texas Instruments BQ24250YFFT — Power Management (PMIC / Gate Driver)

BQ24250YFFT – Texas Instruments 1-Cell Li-Ion Charger, 2A

MPNBQ24250YFFT
Active

Texas Instruments BQ24250YFFT, 1-cell Li-Ion battery charger, 2A max charge current, I²C programmable, 30-bump DSBGA, -40°C to 85°C operation.

$6.3400Ref. price · indicative, final on quote
Packaging30-UFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BQ24250YFFT specifications
ParameterValue
MountingSurface Mount
Battery pack voltage4.2V
Supply voltage10.5V
Current - chargingConstant - Programmable
Charge current - max2A
InterfaceI²C
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case30-UFBGA, DSBGA
Number of cells1
Fault protectionOver Current, Over Temperature, Over Voltage
Battery chemistryLithium Ion
Programmable featuresCurrent

Product details

2A programmable charge current for 1-cell Li-Ion packs

The BQ24250YFFT is a single-cell Li-Ion linear charger from Texas Instruments that delivers up to 2A charge current. The current is set via an external resistor or programmed through the I²C interface, so you can adjust the charge profile in firmware without changing a resistor on the board. The input supply range extends to 10.5V max, which covers standard 5V USB sources and 9V wall adapters. The charger terminates at a regulated 4.2V battery pack voltage.

I²C control and fault protection for reliable charging

The I²C bus lets the host microcontroller set the charge current, termination threshold, and timer limits. This is useful when the same hardware must charge different cell capacities — just change a register value. On-chip fault protection covers over-current, over-temperature, and over-voltage conditions. The charger enters a safe state and reports the fault via the I²C status register.

Industrial temperature range and active production status

Texas Instruments lists this part as Active in production. The part is ROHS3 compliant.

30-bump DSBGA package — layout considerations

The 30-DSBGA package is a wafer-level chip-scale package with 0.4 mm ball pitch. The small footprint saves board space, but the fine pitch demands a well-designed stencil and a solder profile that matches the package's moisture sensitivity level.

Frequently asked questions

Is BQ24250YFFT a direct replacement for BQ24250?

The base product number is BQ24250. The YFFT suffix indicates the 30-DSBGA package and tape-and-reel packaging. Any other package variant (e.g., BQ24250RGET) is not pin-compatible — the DSBGA footprint is unique.

Does BQ24250YFFT support I²C programming?

Yes, the charge current and other parameters are programmable via the I²C interface.