Package and mounting — the exposed-pad thermal requirement
The 8-HVSSOP (3.00 mm × 3.00 mm body, 0.118" width) with exposed pad is a surface-mount package. The pad on the bottom must be soldered to a copper thermal land on the PCB — without that thermal path, the junction will exceed the 125°C limit at full 500 mA charge current in a warm ambient. The supplier device package is listed as 8-HVSSOP, which is TI's designation for the same 8-pin MSOP with exposed pad.
Lifecycle and sourcing posture
That means it is safe to qualify into a new design without worrying about a near-term EOL.