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Texas Instruments BQ24192RGER — Power Management (PMIC / Gate Driver)

BQ24192RGER Texas Instruments Li-Ion Charger, 4.5A, I²C

MPNBQ24192RGER
Active

Texas Instruments BQ24192 series, Li-Ion/Polymer battery charger IC, 1-cell, 4.5A max charge current, I²C interface, 24-VFQFN Exposed Pad package, Tape & Reel.

$3.9900Ref. price · indicative, final on quote
Packaging24-VFQFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BQ24192RGER specifications
ParameterValue
MountingSurface Mount
Battery pack voltage4.2V
Voltage17V
Current - chargingConstant - Programmable
Charge current - max4.5A
InterfaceI²C
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case24-VFQFN Exposed Pad
Number of cells1
Fault protectionOver Current, Over Temperature, Over Voltage
Battery chemistryLithium Ion/Polymer

Product details

Single-cell Li-Ion charger with I²C programmability

The Texas Instruments BQ24192RGER is a single-cell Lithium Ion/Polymer battery charger IC that handles up to 4.5 A of charge current from a supply rail as high as 17 V. Charging parameters are set over an I²C interface, so the charge voltage (4.2 V battery pack target), current profile, and termination thresholds live in firmware rather than fixed resistor dividers.

What the 4.5 A charge current means for your BOM

4.5 A is the maximum programmable charge current — enough to charge a typical 3000 mAh single-cell pack in under an hour at the 1.5 C rate, assuming the input supply and thermal design can sustain it. The constant-current phase is programmable, so you can dial back the current for smaller cells or to stay within the thermal budget of a compact enclosure. Integrated fault protection covers over-current, over-temperature, and over-voltage events — the IC handles the safety monitoring without an external supervisor.

Package and layout for the 24-VQFN

Housed in a 24-VFQFN with exposed pad (4 mm × 4 mm), the BQ24192RGER requires a thermal land pattern on the PCB to conduct heat from the die to the board plane. The 0.5 mm pitch QFN is hand-solderable with a fine tip and flux — a hot-air rework station makes alignment easier, but a careful drag-solder on the perimeter pads works for prototypes.