BQ24092DGQR

Texas Instruments

Texas Instruments BQ24092DGQR single-cell Li-Ion/Polymer linear charger IC, 1A max programmable charge current, USB interface, 10-HVSSOP package, 0°C to 125°C junction temperature.

Texas Instruments BQ24092DGQR
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[IN STOCK] In Stock: 941 pcs
$1.02/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BQ24092DGQR specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Battery pack voltage4.2V
Supply voltage6.45V
Current - chargingConstant - Programmable
Charge current - max1A
InterfaceUSB
Operating temperature0°C~125°C(TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Case10-PowerTFSOP, 10-MSOP (0.118\", 3.00mm Width)
Number of cells1
Fault protectionOver Temperature, Over Voltage, Short Circuit
Battery chemistryLithium Ion/Polymer
Programmable featuresCurrent

Technical details

1A single-cell Li-ion charger with USB input and on-die protection

The Texas Instruments BQ24092DGQR is a linear charger IC for single-cell Lithium Ion or Lithium Polymer battery packs. On-chip fault protection covers over-voltage, over-temperature, and short-circuit conditions — no external supervisor is required for the basic safety envelope.

Charge current and thermal budget

The 1 A maximum charge current is set via an external resistor — the constant-current loop is programmable, so the BOM engineer tailors the charge rate to the cell capacity. For a 500 mAh cell, a 0.5 C rate (500 mA) keeps the die temperature rise manageable in a sealed enclosure.

Protection set and supply range

The protection block monitors the input for over-voltage, the die for over-temperature, and the output for short-circuit — all three trip thresholds are fixed on-chip. The maximum supply voltage is 6.45 V, which covers a standard 5 V USB bus with margin for cable droop and hot-plug transients. No external OVP FET is needed for the USB input.

The BQ24092DGQR is offered in a 10-PowerTFSOP / 10-MSOP package with a body width of 0.118 inches (3.00 mm). The PCB layout must include a thermal land and via array under the pad; the recommended footprint is in the TI datasheet.

No official second-source or cross-reference is listed in the TI documentation, so dual-sourcing depends on a functionally equivalent part from another vendor.

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