The AFE4410YZT: The 30-DSBGA (0.4 mm ball pitch, 0.25 mm ball diameter) demands a controlled impedance PCB stack-up and a solder-mask-defined pad — typical for fine-pitch BGA assembly. The 30-ball array is a 5×6 grid; fan-out is manageable on a 4-layer board. No exposed thermal pad — the DSBGA relies on the PCB copper plane under the package for heat spreading. Ensure the inner-layer ground plane extends under the BGA land pattern for thermal relief.
AFE4410YZT
Texas Instruments
Texas Instruments AFE4410YZT analog front-end, 3-channel, 24-bit, 30-XFBGA DSBGA package, surface mount, Tape & Reel / Cut Tape.
[IN STOCK] In Stock: 5 pcs
MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T
Technical specifications
| Parameter / Attribute | Specification / Value |
|---|---|
| Mounting | Surface Mount |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Number of bits | 24 |
| Case | 30-XFBGA, DSBGA |
| Channels | 3 |
Technical details
AFE4410YZT
[ALLOC] verified