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Texas Instruments ADC101S021CISD/NOPB — Discrete Semiconductors

ADC101S021CISD/NOPB 10-bit SAR ADC, 200 kSPS, 6-WSON

MPNADC101S021CISD/NOPB
End of Life

Texas Instruments ADC101S021CISD/NOPB, 10-bit SAR ADC, 200 kSPS sampling rate, single-ended input, SPI/DSP interface, 6-WSON (2.2x2.5) package, Tape & Reel.

$2.06Ref. price · indicative, final on quote
Packaging6-WDFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ADC101S021CISD/NOPB specifications
ParameterValue
Input typeSingle Ended
MountingSurface Mount
Reference typeSupply
Voltage - supply, analog2.7V ~ 5.25V
Voltage - supply, digital2.7V ~ 5.25V
I/O channels1
InterfaceSPI, DSP
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
ArchitectureSAR
ConfigurationS/H-ADC
Number of bits10
Case6-WDFN Exposed Pad
Ratio - s (H:ADC)1:1
Number of a (D converters)1
Sampling rate (Per second)200k

Product details

10-bit SAR ADC in a 6-WSON — what the 200 kSPS and single supply mean for your BOM

The ADC101S021CISD/NOPB is a 10-bit successive-approximation-register (SAR) ADC from Texas Instruments, sampling at 200 kSPS with a single-ended input. The SAR architecture means the conversion is deterministic — no pipeline delay — so the sample timing is predictable cycle-to-cycle, which matters when the ADC is triggered by a timer or PWM edge in a motor-drive or sensor-loop application. This simplifies the power tree and reduces BOM count, but it also means the ADC's full-scale range tracks the supply voltage: a 3.3 V rail gives a 0–3.3 V input span, and any supply noise couples directly into the conversion result. The SPI/DSP serial interface connects directly to most MCU SPI peripherals with a single data line, a clock, and a chip-select. The conversion is initiated by the chip-select edge, and the 10-bit result is shifted out on the next 10–16 SCLK cycles — no external start-convert pin needed.

Package, footprint, and thermal — the 6-WSON exposed pad

The exposed pad on the bottom must be soldered to a PCB thermal land and connected to the analog ground plane — this is the primary thermal path and also the electrical ground reference for the ADC. Without a proper via array under the pad, the junction temperature rises above the 85 °C ambient limit faster than the 0.5 °C/W thermal resistance suggests.