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Texas Instruments 74S10DC — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments 74S10DC NAND Gate, 3-Ch 3-In, 14-CDIP

MPN74S10DC
End of Life

Texas Instruments 74S series NAND Gate, 74S10DC, 3 circuits, 3 inputs, 14-CDIP (0.300", 7.62mm) through hole, 4.75V ~ 5.25V supply, 5ns propagation delay at 5V 50pF.

$0.33Ref. price · indicative, final on quote
Packaging14-CDIP (0.300", 7.62mm)
RoHSRoHS non-compliant
Series74S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

74S10DC specifications
ParameterValue
Series74S
Logic typeNAND Gate
MountingThrough Hole
Voltage4.75V ~ 5.25V
Current - quiescent27 mA
I/O channels3
Operating temperature0°C ~ 70°C
PackageBulk
Case14-CDIP (0.300\", 7.62mm)
Number of circuits3
Max propagation delay @ v, max CL5ns @ 5V, 50pF

Product details

Triple 3-input NAND in a hermetic ceramic DIP

The 74S10DC is a 74S-series triple 3-input NAND gate from Texas Instruments, packaged in a 14-lead ceramic DIP (CDIP) with 0.300-inch body width. It performs the NAND logic function across three independent gates, each with three inputs — a configuration used in address decoding, gating, and combinatorial logic where the third input eliminates the need for an external inverter on a two-input gate.

5 ns propagation delay at 5 V — the speed ceiling for the logic path

Maximum propagation delay is 5 ns at 5 V supply with a 50 pF load. This sets the timing budget for the signal path: the 5 ns figure is the worst-case delay from any input transition to the output crossing the threshold, so the downstream latch or register must hold its data window open long enough to absorb this delay plus the interconnect and input capacitance of the receiving device.

14-CDIP hermetic package — through-hole board integration

The 14-CDIP (0.300-inch, 7.62 mm) ceramic dual-inline package with through-hole leads is designed for socketed or soldered insertion into a PCB. The ceramic body provides a hermetic seal — moisture ingress is negligible compared to plastic DIPs, so the part has no MSL floor-life constraint and does not require a moisture bake before wave or hand soldering. The 0.100-inch (2.54 mm) lead pitch is standard for DIP layouts; the 0.300-inch row spacing fits the narrower DIP footprint (not the 0.600-inch wide-body).