Active TTL flip-flop for legacy board support
The 74LS174PC: Supplied in a Bulk package — the through-hole DIP form factor suits existing board layouts that use traditional wave-solder assembly rather than surface-mount reflow.
RoHS compliance and solder process fit
Marked RoHS non-compliant — the part uses leaded solder termination, which means the board assembly line must run a tin-lead profile, not a lead-free SAC reflow. A legacy solder pot or hand-soldering station set for 63/37 or 60/40 alloy is the correct process. For repair or rework in a lead-free facility, the iron temperature should be dialed back to avoid lifting the pad; the leaded joint wets at a lower temperature than the RoHS-compliant solder already on the board.