16 V in the 01005 footprint — what that means for SMPS filtering
The EMK042B7151KC-W: The X7R temperature coefficient holds the capacitance within ±15 % across that span — acceptable for SMPS filtering and decoupling near a switching node, but wider than COG/NP0, so this is not the part to reach for in a precision analog front-end where value stability matters more than volume.
0.22 mm seated height — the constraint that decides reworkability
The maximum seated height is 0.009 inches (0.22 mm), and the land pattern is 0.40 mm by 0.20 mm — the part sits just above the pad plane, which means any solder paste print misalignment can bridge paste onto the component bottom during reflow. At this thickness the 01005 form factor is a field-rework challenge: the pads are too small for reliable hand-placement, and hot-air rework without a correctly sized nozzle risks shifting the body onto adjacent lands. Lab bench rework with a hot plate or hot-air station is the practical route — not site-level swap territory. No moisture sensitivity level appears in the listed specs; baking before rework is the standard precaution for any MLCC below 0.30 mm seated height when the MSL floor is unconfirmed.