VIPER06LSTR

STMicroelectronics · VIPer™ plus Series

STMicroelectronics VIPER06LSTR, VIPer™ plus series, offline switching regulator, 8 W output, 800 V breakdown, 60 kHz switching frequency, buck/flyback topology, 10-SSOP package, active production.

STMicroelectronics VIPER06LSTR
Download datasheet (PDF)
[IN STOCK] In Stock: 1,328 pcs
$1.54/ pc

Volume pricing

Buy Now

MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

VIPER06LSTR specifications
Parameter / AttributeSpecification / Value
SeriesVIPer™ plus
MountingSurface Mount
Voltage - start up13 V
Voltage - breakdown800V
Voltage - supply (Vcc (Vdd))11.5V ~ 23.5V
Power (Watts)8 W
Frequency - switching60kHz
Duty cycle70%
Operating temperature-40°C ~ 150°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
TopologyBuck, Flyback
Case10-SOP (0.154\", 3.90mm Width)
Fault protectionCurrent Limiting, Open Loop, Over Temperature
Output isolationEither
Internal switchYes

Technical details

8 W offline switcher with 800 V avalanche-rugged MOSFET

The VIPER06LSTR integrates a 800 V breakdown power MOSFET and a PWM controller in a single 10-SSOP package, delivering up to 8 W in buck or flyback configurations. The 60 kHz switching frequency keeps the transformer or inductor physically small while staying below the conducted-emission limits that plague higher-frequency designs in appliance and industrial auxiliary supplies. The 13 V start-up threshold and 11.5 V to 23.5 V supply range cover the common bias rails in off-line converters.

Fault protection set for unattended or enclosed operation

Built-in current limiting, open-loop detection, and over-temperature shutdown protect the converter against output short circuits, feedback failures, and thermal runaway. Output isolation is configurable as either isolated or non-isolated, so the same MPN can serve a flyback with an optocoupler or a simple buck without a feedback transformer. This flexibility reduces the number of unique BOM lines across a product family.

Active production — no imminent end-of-life risk

Package and footprint — 10-SSOP with 0.154-inch body width

The 0.50 mm lead pitch requires a controlled solder-paste stencil aperture to avoid bridging, but the package is widely supported by assembly houses. No exposed thermal pad is present; junction-to-ambient thermal resistance is managed through the copper area on the PCB.

VIPER06LSTR
[ALLOC] verified
Quote