TS4962MEIJT

STMicroelectronics

STMicroelectronics TS4962MEIJT Class D audio amplifier, mono 1-channel, 2.8W output into 4Ω, 2.4V to 5.5V supply, -40°C to 85°C, 9-UFBGA/FCBGA package, surface mount.

STMicroelectronics TS4962MEIJT
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TS4962MEIJT specifications
Parameter / AttributeSpecification / Value
TypeClass D
Output type1-Channel (Mono)
MountingSurface Mount
Supply voltage2.4V ~ 5.5V
Max output power x channels @ load2.8W x 1 @ 4Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesDepop, Differential Inputs, Standby, Thermal Protection
Case9-UFBGA, FCBGA

Technical details

2.8W mono Class D in a 9-bump FlipChip

The STMicroelectronics TS4962MEIJT is a mono Class D audio power amplifier delivering 2.8W into a 4Ω load from a 5V supply, all in a 9-bump FlipChip package that sits about the size of a grain of rice. It runs on a 2.4V to 5.5V supply rail, so a single Li-ion cell or a 3.3V/5V regulated rail both work. The differential inputs reject common-mode noise picked up on long input traces — useful when the amp sits on a separate board from the codec. Built-in depop circuitry suppresses the turn-on thump that otherwise annoys the end user, and the standby pin lets the system MCU cut quiescent draw to near-zero when audio is idle.

This part lives in the gap between a headphone driver and a multi-watt speaker amp. 2.8W into 4Ω is enough for a portable Bluetooth speaker, a battery-powered soundbar, a smart-home voice assistant, or an industrial panel with audio feedback. The 9-FlipChip package means the PCB must handle a 0.5mm-pitch BGA-like footprint with microvias or very fine traces; this is not a hand-solderable part for prototyping. For 8Ω speakers, the output power drops to roughly half (about 1.4W at the same supply voltage), which may still be adequate for a notification chime or voice prompt.

Package reality for the layout and rework desk

The 9-UFBGA / 9-FlipChip is a tiny array — nine solder bumps on the bottom, no leads. For the PCB layout engineer: expect a 0.5mm ball pitch, requiring at least a four-layer board if signals must escape the inner balls. For the rework tech: this is a hot-air or reflow-only package. No hand-soldering. The thermal protection feature means the die shuts down before the junction exceeds the safe limit, but the tiny package has limited thermal mass; continuous full-power output into 4Ω at 85°C ambient needs a thermal analysis, not just a spec check.

ROHS3 compliant.

TS4962MEIJT
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