STTH5R06DJF-TR

STMicroelectronics

STMicroelectronics STTH5R06DJF-TR, Fast Recovery Diode, 600 V, 5 A, 55 ns trr, Surface Mount, 8-PowerVDFN PowerFlat 5x6, ROHS3 Compliant.

STMicroelectronics STTH5R06DJF-TR
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[IN STOCK] In Stock: 5 pcs
$6.54/ pc

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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STTH5R06DJF-TR specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - DC reverse (Vr)600 V
Voltage - forward (Vf) (Max) @ if2 V @ 5 A
Current - reverse leakage @ vr60 µA @ 600 V
Current - average rectified5A
Operating temperature - junction175°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologyStandard
Case8-PowerVDFN
Reverse recovery time55 ns

Technical details

The STTH5R06DJF-TR is a 600 V, 5 A fast-recovery epitaxial diode from STMicroelectronics, built for hard-switched topologies where reverse recovery charge adds to switching loss. Its 55 ns reverse recovery time (trr) keeps the diode from conducting backward during the MOSFET turn-on transition, which directly cuts the current spike and the associated EMI signature in a continuous-conduction-mode PFC boost stage or a flyback clamp.

5 A continuous at 600 V — derating and thermal budget

Rated 5 A average rectified current at a junction temperature up to 175°C. The forward voltage drop is 2 V at 5 A — that is 10 W conduction loss at full rated current, so the PowerFlat 5x6 exposed pad needs a decent copper area on the PCB to keep the junction below the 175°C ceiling. Reverse leakage is 60 µA at 600 V, which is negligible at room temperature but climbs with junction heat; budget the leakage term in the thermal calculation if the diode runs hot.

PowerFlat 5x6 — footprint and rework

The 8-PowerVDFN package (PowerFlat 5x6) is a 5 mm × 6 mm QFN-style body with an exposed die attach pad. The pad is the main thermal path — solder it to a copper pour with at least a few vias to inner layers. The part is MSL-sensitive like any QFN; bake the reel if the moisture barrier bag is punctured. Under a hot-air station the small body reflows fast; the trick is getting the paste volume right on the pad so the part self-centres without voiding the thermal interface.

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