STTH2003CFP

STMicroelectronics

ST STTH2003CFP, Fast Recovery Diode Array, 1 Pair Common Cathode, 300V Vr, 10A Io per diode, 35ns trr, 1.25V Vf @ 10A, TO-220-3 Full Pack (TO-220FP), Through Hole, Tube.

STMicroelectronics STTH2003CFP
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Technical specifications

STTH2003CFP specifications
Parameter / AttributeSpecification / Value
MountingThrough Hole
Voltage - DC reverse (Vr)300 V
Voltage - forward (Vf) (Max) @ if1.25 V @ 10 A
Current - reverse leakage @ vr20 µA @ 300 V
Current - average rectified (Io) (per diode)10A
Operating temperature - junction175°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube
TechnologyStandard
CaseTO-220-3 Full Pack
Diode configuration1 Pair Common Cathode
Reverse recovery time35 ns

Technical details

35 ns trr — fast recovery for PFC and secondary rectification

300 V / 10 A — the application envelope

With a 300 V reverse voltage ceiling and 10 A forward current per diode, this part handles the voltage stress in a 400 VDC bus PFC stage with margin, and the current density for a 200–300 W output rectifier. The 1.25 V forward drop at 10 A sets the conduction loss floor — at 10 A that is 12.5 W per diode, so the TO-220FP full-pack package must be heatsunk to keep the junction below the 175°C absolute maximum.

TO-220FP — isolated full-pack, no insulating pad needed

The TO-220FP (full-pack) package has the metal tab fully encapsulated in plastic, so the heatsink interface is electrically isolated. That saves the cost and assembly step of a separate insulating pad and thermal grease. The through-hole mounting suits single-sided or two-layer power boards where the tab is bolted directly to a chassis or heatsink.

STTH2003CFP
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