STTH1502FP

STMicroelectronics

STMicroelectronics STTH1502FP, Fast Recovery =< 500ns, > 200mA (Io), Standard Diode, 200 V, 15 A, 36 ns trr, Through Hole, TO-220-2 Full Pack, Tube.

STMicroelectronics STTH1502FP
Download datasheet (PDF)
[IN STOCK] In Stock: 3 pcs
$1.59/ pc

Volume pricing

Buy Now

MOQ 1 · Tube · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STTH1502FP specifications
Parameter / AttributeSpecification / Value
Diode typeStandard
MountingThrough Hole
Voltage - DC reverse (Vr)200 V
Voltage - forward (Vf) (Max) @ if1.1 V @ 15 A
Current - reverse leakage @ vr10 µA @ 200 V
Current - average rectified15A
Operating temperature - junction175°C(Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube
CaseTO-220-2 Full Pack
Reverse recovery time36 ns

Technical details

A 15 A fast-recovery diode in a fully isolated TO-220 package

This part is typically used in power-factor correction (PFC) boost stages, output rectification in switched-mode power supplies, and freewheeling diodes in motor drives where fast switching and low recovery losses matter.

The 36 ns reverse recovery time places this diode in the fast-recovery class, well under the 500 ns threshold. In a continuous-conduction-mode PFC stage, that trr directly reduces the turn-on loss in the MOSFET and cuts EMI ringing at the switching node. Compare this to a standard recovery diode (trr in the microsecond range) where the reverse current spike adds significant dissipation and noise. The 1.1 V forward drop at 15 A is typical for a 200 V silicon fast diode — no surprise there, but the 10 µA leakage at 200 V reverse is low enough to keep standoff losses negligible at high line.

Mounting and thermal handling with the TO-220 Full Pack

The TO-220FPAC (Full Pack) package has a fully encapsulated backside — no exposed metal tab. That means the mounting screw does not need an insulating bushing or mica washer, and the case is electrically isolated. For a 15 A average current, you still need a heatsink; the junction is rated to 175 °C max, so thermal design should keep the junction below that under worst-case load and ambient. The through-hole leads suit point-to-point wiring or a PCB with drilled holes — no reflow profile needed.

STTH1502FP
[ALLOC] verified
Quote