STTH12R06G-TR

STMicroelectronics

STMicroelectronics STTH12R06G-TR, general purpose fast recovery diode, 600 V, 12 A, 45 ns trr, D2PAK surface mount package, ROHS3 compliant.

STMicroelectronics STTH12R06G-TR
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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STTH12R06G-TR specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - DC reverse (Vr)600 V
Voltage - forward (Vf) (Max) @ if2.9 V @ 12 A
Current - reverse leakage @ vr45 µA @ 600 V
Current - average rectified12A
Operating temperature - junction175°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologyStandard
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Reverse recovery time45 ns

Technical details

600 V, 12 A, 45 ns trr — the fast-recovery diode for PFC and flyback

It is built for the output rectification stage of power-factor-correction (PFC) circuits and flyback converters where the recovery speed directly sets the switching loss and EMI signature.

The 45 ns reverse recovery time places this diode in the fast-recovery class (≤ 500 ns at > 200 mA). In a continuous-conduction-mode PFC, that 45 ns trr keeps the reverse-recovery charge low enough to avoid excessive turn-on loss in the MOSFET and to keep the ringing amplitude within the EMI filter's budget. The 2.9 V forward drop at 12 A is the conduction loss trade-off for that speed — expect higher Vf than a standard 600 V rectifier.

175 °C junction — thermal headroom for tight layouts

The maximum junction temperature is rated at 175 °C. That extra 25 °C over the common 150 °C ceiling gives the designer margin when the D2PAK is mounted on a single-sided board with limited copper area for heatsinking. The 45 µA reverse leakage at 600 V is a room-temperature figure; expect it to rise with junction temperature, so the thermal design should budget for the leakage increase at full load.

D2PAK package — surface-mount power in a TO-263 footprint

The TO-263-3 (D2PAK) package is a surface-mount power package with a large exposed copper tab on the bottom. The tab is the anode connection and the primary thermal path to the board. The PCB footprint should use the recommended copper pad area under the tab — the datasheet's RthJA figure assumes that pad.

ROHS3 compliant.

STTH12R06G-TR
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