ISOTOP chassis mount — bolted-down thermal path
The STTH12012TV1: Housed in the ISOTOP (also ISOTOP®) package, the module bolts directly to a heatsink or chassis. The baseplate provides the primary thermal interface — the junction-to-case thermal resistance is set by the die attach and the copper base, not by a plastic body. Chassis-mount means the diode sits outside the PCB area; the power loop runs through screw terminals or busbars, keeping the board trace current off the high-current path.
Forward drop and leakage — the thermal budget drivers
At 60 A forward current, the maximum forward voltage (Vf) is 2.25 V — that is 135 W conduction loss per diode at full load, which the heatsink must extract. Reverse leakage at the full 1200 V blocking voltage is 30 µA, negligible for the static loss calculation but worth noting for parallel operation: a small mismatch in Vf between the two independent diodes in the same package can unbalance the current sharing, so a derated total current is safer than running both legs at the 60 A ceiling simultaneously.