STTH110A

STMicroelectronics

STMicroelectronics STTH110A, Fast Recovery Rectifier, 1000 V Vr, 1 A Io, 75 ns trr, 1.7 Vf @ 1 A, DO-214AC SMA, Surface Mount, Active.

STMicroelectronics STTH110A
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STTH110A specifications
Parameter / AttributeSpecification / Value
Diode typeStandard
MountingSurface Mount
Voltage - DC reverse (Vr)1000 V
Voltage - forward (Vf) (Max) @ if1.7 V @ 1 A
Current - reverse leakage @ vr10 µA @ 1000 V
Current - average rectified1A
Operating temperature - junction175°C(Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR); Cut Tape (CT)
CaseDO-214AC, SMA
Reverse recovery time75 ns

Technical details

The STTH110A is a 1000 V, 1 A fast-recovery rectifier from STMicroelectronics, with a 75 ns reverse recovery time that puts it in the ultrafast class. It is built for continuous-current-mode PFC boost stages, flyback snubbers, and output rectification in 400 V bus power supplies where switching losses matter. The 1.7 V forward drop at 1 A is typical for a 1 kV device — the trade-off for the high voltage blocking and fast turn-off.

A 75 ns reverse recovery time at 1 A and 1000 V means the diode can switch at 100 kHz or higher without excessive reverse-recovery losses. In a PFC boost stage running a 400 V DC bus, that trr keeps the MOSFET turn-on current spike low enough to avoid ringing and EMI filter headaches. It is also fast enough for the secondary-side rectification in a 100 W to 300 W flyback converter, where the diode's recovery charge directly affects the leakage-inductance reset time.

DO-214AC SMA — rework and footprint notes

The SMA package is a JEDEC standard outline, so the footprint is shared with dozens of other 1 A rectifiers from various vendors. It is a two-pin surface-mount part with a clear cathode band — pin 1 orientation is unambiguous under a hot-air station. The plastic body is MSL 1 per the package family, so no bake required before reflow as long as the reel seal is intact. For hand rework, a 350 °C hot-air nozzle at low flow lifts the part cleanly without lifting the pad, provided the board has a thermal relief on the cathode pad.

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