STMicroelectronics STPS30H60CFP, Schottky diode array, 1 pair common cathode, 60 V DC reverse, 15 A average rectified per diode, 660 mV forward drop at 15 A, Fast Recovery ≤ 500 ns, TO-220-3 Full Pack, through hole, 175°C max junction.
| Parameter | Value |
|---|---|
| Diode type | Schottky |
| Mounting | Through Hole |
| Voltage - DC reverse (Vr) | 60 V |
| Voltage - forward (Vf) (Max) @ if | 660 mV @ 15 A |
| Current - reverse leakage @ vr | 60 µA @ 60 V |
| Current - average rectified (Io) (per diode) | 15A |
| Operating temperature - junction | 175°C(Max) |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Package | Tube |
| Case | TO-220-3 Full Pack |
| Diode configuration | 1 Pair Common Cathode |
Reverse leakage is 60 µA at 60 V rated reverse voltage. Like all Schottky diodes, leakage rises with junction temperature; at elevated Tj the leakage contribution to the thermal budget needs to be checked against the heatsink's capacity.
It is ROHS3 compliant.
Buyers need to validate electrical and mechanical specs before design-in.
Sourcing buyers need to compare price and availability across distributors.
Engineers often need drop-in alternatives for second sourcing or when part is unavailable.
For layout and footprint verification before PCB design.
Brokers and buyers need lifecycle status to assess long-term availability.
Key specs like Vr, If, Vf must be confirmed for the application.