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STMicroelectronics STPS2L60A — Discrete Semiconductors

STMicroelectronics STPS2L60A Schottky Diode, 60 V, 2 A, SMA

MPNSTPS2L60A
Active

STMicroelectronics STPS2L60A Schottky diode, 60 V DC reverse, 2 A average rectified, 600 mV forward drop at 2 A, DO-214AC (SMA) surface-mount package, fast recovery ≤ 500 ns.

$0.6700Ref. price · indicative, final on quote
PackagingDO-214AC, SMA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STPS2L60A specifications
ParameterValue
Diode typeSchottky
MountingSurface Mount
Voltage - DC reverse (Vr)60 V
Voltage - forward (Vf) (Max) @ if600 mV @ 2 A
Current - reverse leakage @ vr100 µA @ 60 V
Current - average rectified2A
Operating temperature - junction150°C(Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR); Cut Tape (CT)
CaseDO-214AC, SMA

Product details

Schottky barrier, 60 V, 2 A — forward drop and thermal budget

The STPS2L60A is a 60 V, 2 A Schottky rectifier in the DO-214AC (SMA) surface-mount package. Its forward voltage is 600 mV maximum at the full 2 A rated current — this is the conduction loss floor for low-voltage rectification, OR-ing, and freewheeling applications where every millivolt of drop costs efficiency. Reverse leakage is 100 µA at the 60 V rated voltage. Because Schottky leakage rises exponentially with junction temperature, at 125 °C the leakage current can approach the forward conduction savings — the thermal derating curve in the datasheet sets the usable current in a given ambient. The 150 °C maximum junction temperature defines the thermal budget. The SMA package's junction-to-ambient thermal resistance means the 2 A rating is achievable only with adequate copper pad area on the cathode tab — a standard 25 mm² pad on a 2-layer board typically derates to about 1.5 A at 85 °C ambient.

Package and board-fit — SMA land pattern

The DO-214AC (SMA) package uses a standard JEDEC footprint with a 2.6 mm × 2.0 mm cathode tab pad. The STPS2L60A is a direct drop-in for any SMA land pattern — no layout change from the sibling STPS2L60UF, which uses the same die in an SMA package. Available in Tape & Reel (TR) and Cut Tape (CT) options for both volume reflow and prototype builds.

Frequently asked questions

Will STPS2L60A drop into a board that was specified around STPS2L60UF?

Yes — both use the same DO-214AC (SMA) package and the same Schottky die. The STPS2L60UF is the UF-package variant (SMA flat-lead), but the land pattern is identical. No board layout change is needed.