STPS1L40M

STMicroelectronics

STMicroelectronics STPS1L40M Schottky diode, 40 V reverse, 1 A forward, 460 mV Vf at 1 A, 63 µA leakage at 40 V, fast recovery ≤ 500 ns, DO-216AA STmite surface-mount package, ROHS3 compliant, active production.

STMicroelectronics STPS1L40M
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MOQ 5 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STPS1L40M specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - DC reverse (Vr)40 V
Voltage - forward (Vf) (Max) @ if460 mV @ 1 A
Current - reverse leakage @ vr63 µA @ 40 V
Current - average rectified1A
Operating temperature - junction150°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologySchottky
CaseDO-216AA

Technical details

40 V, 1 A Schottky — the conduction-loss floor

The STPS1L40M is a 40 V, 1 A Schottky barrier rectifier in the proprietary DO-216AA STmite surface-mount package. Its 460 mV maximum forward voltage at 1 A sets the conduction-loss floor for a low-voltage rail — every mV of Vf drop is heat that must be sunk through the small package footprint.

Reverse leakage and thermal budget at 150 °C junction

Reverse leakage is 63 µA at 40 V reverse.

The recovery time is rated ≤ 500 ns at forward current > 200 mA, placing it in the fast-recovery Schottky class. This suits it for low-to-mid-frequency switching supplies and polarity-protection diodes where the reverse-recovery charge is low enough to skip a snubber in most designs.

STmite package — layout consideration

The DO-216AA (STmite) package is a proprietary low-profile surface-mount body with a single cathode tab. The land pattern differs from standard SOD-123 or SMA footprints — the STM application note for the STmite package gives the recommended copper pad and solder-paste stencil aperture. Without that pattern, the solder joint area under the tab may be undersized for the 1 A continuous rating at elevated ambient.

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