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STMicroelectronics STP55NF06FP — Discrete Semiconductors

STP55NF06FP MOSFET N-CH 60V 50A TO-220FP, 18 mOhm

MPNSTP55NF06FP
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STMicroelectronics STripFET™ II STP55NF06FP, N-Channel MOSFET, 60 V Vdss, 50 A Id, 18 mOhm Rds(on) at 10 V, 60 nC Qg, TO-220 Full Pack, -55°C to 175°C.

$1.5500Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
SeriesSTripFET™ II
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STP55NF06FP specifications
ParameterValue
SeriesSTripFET™ II
FET typeN-Channel
MountingThrough Hole
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C50A (Tc)
Power dissipation30W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs18mOhm @ 27.5A, 10V
Gate charge (Qg) (Max) @ vgs60 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1300 pF @ 25 V

Product details

60 V, 50 A N-channel — the load-switch and converter tier

The STP55NF06FP: That 60 V Vdss gives a comfortable derating margin on a 48 V bus or a 12 V battery-backed rail where transients can ring above 40 V. The 50 A Id rating is the package-limited ceiling at Tc=25°C; real-world current depends on the heatsink and ambient — the TO-220FP's 30 W power dissipation ceiling is the practical constraint.

18 mOhm on-resistance — conduction loss at the operating point

That is the conduction loss floor at the datasheet test point; actual on-resistance rises with junction temperature — expect roughly 1.5× the 25°C value at 125°C Tj. For a 20 A load, I²R loss at 25°C is about 7.2 W, which the TO-220FP's 30 W dissipation limit can handle with a modest heatsink.

Gate charge and switching — 60 nC at 10 V

Total gate charge is 60 nC at Vgs=10 V. That is moderate for a 50 A-class MOSFET — the gate driver needs to source and sink that charge each switching cycle.

TO-220 Full Pack — isolated tab saves assembly steps

The TO-220FP (Full Pack) package has a fully molded plastic body that isolates the mounting tab from the drain. Through-hole mounting suits point-of-load boards and power supplies where wave-solder assembly is the norm.

The 175°C maximum exceeds the typical 150°C industrial ceiling, giving extra thermal headroom for high-ambient environments like motor drives inside sealed enclosures or power stages near hot surfaces.

ROHS3 compliant.

Frequently asked questions

What is the closest pin-compatible alternative to STP55NF06FP?

No official pin-compatible second-source or cross-reference is listed in the manufacturer documentation for this STP55NF06FP. The BOM line is single-sourced to this STMicroelectronics device. For a drop-in replacement, verify the package (TO-220FP), Vdss (60 V), and Rds(on) (18 mOhm) against any candidate part.