STM8L101K3U6TR — 8-bit MCU in the EnergyLite family
Package and mounting — 32-UFQFN with exposed pad
Housed in a 32-UFQFN exposed-pad package (supplier device package 32-UFQFPN, 5x5 mm), this is a surface-mount part intended for reflow assembly. The exposed thermal pad needs a via-stitched ground plane on the PCB to pull heat out of the die; without it, continuous operation above 70°C ambient at full I/O load will push junction temperature. The 5x5 mm footprint fits tight layouts in handheld or wearable designs.
Peripherals and connectivity for control-loop tasks
With 30 I/O lines available, this MCU can handle a modest keypad plus a small character LCD and still leave pins for a serial debug header.
STMicroelectronics lists the STM8L101K3U6TR as Active (current production).
