The 144-UFBGA (10x10 mm) package demands careful PCB layout — the fine-pitch BGA needs a controlled solder-paste stencil and X-ray inspection after reflow.
For dual-sourcing resilience, the STM32L4R9ZI (same base number, different package variant) is the closest sibling — verify pin compatibility against your specific layout before substituting.
Data converters and analog integration
For a calibration-minded build, the ADC's reference accuracy and temperature drift are worth verifying against the system's error budget — the datasheet's typical figures are a starting point, but a traceable reference check during prototype validation catches long-term drift before it becomes a field issue.