Package and footprint — 100-LQFP
Housed in a 100-LQFP package (14x14 mm body), surface-mount soldering with standard reflow profiles. The 83 I/O are accessible on a 0.5 mm pitch; the exposed pad (if present on this variant) should be connected to ground with thermal vias for best heat transfer.
There is no last-time-buy risk for new designs.
