Package and footprint — 100-LQFP
Housed in a 100-LQFP package (14x14 mm body), surface-mount soldering with standard reflow profiles. The 83 I/O are accessible on a 0.5 mm pitch; the exposed pad (if present on this variant) should be connected to ground with thermal vias for best heat transfer. No special bake is required if the moisture barrier bag is intact — MSL 3 is typical for this package family.
Lifecycle and supply posture
There is no last-time-buy risk for new designs.
