No successor order code has been issued because none is needed.
144-UFBGA footprint — layout considerations
Housed in a 144-ball UFBGA package (10x10 mm body), this MCU demands a fine-pitch BGA layout with micro-vias or via-in-pad for the inner balls. The 114 general-purpose I/O give ample headroom for parallel buses, external memory interfaces (EBI/EMI), and the full suite of serial connectivity — CAN, I²C, SPI, QSPI, UART/USART, SAI, and SWPMI.
