CANbus on-chip — no external controller needed
The STM32L471RET6TR: The integrated CAN controller in the 64-LQFP package reduces BOM count. The 51 I/O lines handle a parallel display bus, keypad matrix, and sensor interrupts without a port expander.
For a production BOM that needs multi-year supply assurance, this part carries no imminent obsolescence risk — though as with any semiconductor, monitoring PCNs for package or wafer-fab changes is standard practice for long-life designs.
Package and footprint — 64-LQFP, hand-solderable
The device comes in a 64-lead LQFP with a 10x10 mm body and 0.5 mm pitch. Surface-mount assembly is straightforward with standard reflow profiles; the exposed pad on the bottom side (if present per the package drawing) should be stitched to ground with thermal vias for best heat transfer.
Analog peripherals — 16-channel 12-bit ADC, dual 12-bit DAC
The data converter subsystem includes a 16-channel 12-bit ADC and two 12-bit DAC channels.