Skip to main content
STMicroelectronics STM32L412RBI6P — Microcontrollers & Processors (MCU / MPU / DSP)

STM32L412RBI6P ARM Cortex-M4 MCU, 80 MHz, 128 KB Flash

MPNSTM32L412RBI6P
Active

STMicroelectronics STM32L4 series, STM32L412RBI6P, ARM Cortex-M4 32-Bit Single-Core MCU, 80MHz, 128KB Flash, 40K x 8 RAM, 1.71V ~ 3.6V, 52 I/O, 64-UFBGA, -40°C ~ 85°C.

$2.7766Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

STM32L412RBI6P Technical Specifications
ParameterValue
SeriesSTM32L4
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed80MHz
PackageTray
RAM size40K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, PWM, WDT
ConnectivityI2C, Infrared, IrDA, LINbus, Quad SPI, SPI, UART/USART, USB
Number of i (O)52
Core processorARM® Cortex®-M4
Case64-UFBGA
Data convertersA/D 16x12b
Program memory size128KB (128K x 8)

Product details

80 MHz Cortex-M4 with 128 KB Flash — the low-power workhorse

It is built for energy-sensitive designs that still need the DSP extensions and single-precision FPU of the M4 core — think battery-powered sensor nodes, portable medical devices, and industrial wireless gateways where every microamp in sleep mode counts.

Industrial temperature grade and compact BGA footprint

The 64-UFBGA package measures 5x5 mm — a dense ball grid array that keeps the PCB footprint small but requires careful fanout and a controlled impedance stackup if you route the Quad SPI or USB signals. The 52 available I/O pins give enough headroom for a parallel display interface, external memory bus, or a bank of sensor interrupts alongside the usual UART, I2C, and SPI peripherals.

Peripheral set and connectivity for mixed-signal designs

The connectivity block covers I2C, SPI, Quad SPI, UART/USART, LIN, IrDA, and USB, so it can talk to external Flash, radio modules, and sensor hubs without glue logic. The 16-channel 12-bit ADC handles analog inputs from thermistors, current shunts, or bridge sensors, which is typical for the STM32L4's target role as a mixed-signal host in field instrumentation.

Active lifecycle — no obsolescence pressure on new designs

For supply resilience, the base product number STM32L412 covers multiple Flash and package variants across the STM32L4 series, which gives you pin-compatible density options if the firmware grows beyond 128 KB.

Frequently asked questions

What package does STM32L412RBI6P use and what is the footprint?

It comes in a 64-UFBGA package with a 5x5 mm body. The supplier device package is 64-UFBGA (5x5), a fine-pitch ball-grid array that requires a multilayer PCB with microvias for fanout.

What are the alternatives to STM32L412RBI6P in the STM32L4 family?

Within the STM32L4 series, pin-compatible alternatives include devices with higher Flash density (up to 512 KB) or additional SRAM, all sharing the same 64-UFBGA footprint and peripheral set. The base product number STM32L412 covers the 128 KB Flash tier; moving to STM32L432 or STM32L452 gives more memory while keeping the same core and package options.