The STM32L412CBU6P: 38 I/Os and connectivity including I2C, SPI, Quad SPI, UART/USART, USB, LIN, IrDA, and infrared in a 7x7 mm exposed-pad package.
128 KB Flash and 40 KB SRAM — sizing the firmware and data buffers
128 KB Flash (128K x 8) and 40 KB SRAM (40K x 8).
48-UFQFN exposed pad — rework and thermal reality
7x7 mm exposed-pad package. The pad is the primary thermal path.
Connectivity and peripherals — what the 38 I/Os buy you
38 I/Os with Quad SPI, USB, two I2C, three USARTs, two SPIs, and a 10-channel 12-bit ADC. Internal oscillator available.
For production BOMs that need a second source, the STM32L412 family includes pin-compatible density options (64 KB, 128 KB, 256 KB Flash) in the same 48-UFQFN footprint, so a firmware-only change can adapt to a different Flash size without a PCB spin.
