Package and footprint — the 5x5 mm UFQFPN
Housed in a 32-UFQFPN with an exposed pad (5x5 mm body), this part is surface-mount only. The exposed thermal pad needs a via stitch to the ground plane on the PCB to pull heat out of the die — without it, continuous operation above 85°C ambient gets tight. The package is compact enough for space-constrained designs like sensor nodes or handheld tools.
