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STMicroelectronics STM32L031E4Y6TR — Microcontrollers & Processors (MCU / MPU / DSP)

ST STM32L031E4Y6TR ARM Cortex-M0+ MCU, 32 MHz, 16 KB Flash

MPNSTM32L031E4Y6TR
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STMicroelectronics STM32L0 series STM32L031E4Y6TR, ARM Cortex-M0+, 32-Bit Single-Core, 32MHz, 16KB (16K x 8) FLASH, 8K x 8 RAM, 1K x 8 EEPROM, 25-UFBGA/WLCSP, 20 I/O, 1.8V ~ 3.6V, -40°C ~ 85°C.

$1.1893Ref. price · indicative, final on quote
STMicroelectronics STM32L031E4Y6TR datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

STM32L031E4Y6TR specifications
ParameterValue
SeriesSTM32L0
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed32MHz
PackageTape & Reel (TR)
RAM size8K x 8
Core size32-Bit Single-Core
EEPROM size1K x 8
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)20
Core processorARM® Cortex®-M0+
Case25-UFBGA, WLCSP
Data convertersA/D 10x12b
Program memory size16KB (16K x 8)

Product details

32 MHz Cortex-M0+ in a WLCSP — the space-constrained, low-power MCU choice

The part is aimed at battery-operated, space-limited, and industrial sensing applications where every milliwatt and square millimeter counts.

Memory budget and peripheral set — what fits, what doesn't

The 1 KB EEPROM (emulated or dedicated) holds calibration constants and configuration data without wearing the Flash. The 20 I/O lines in the WLCSP are enough for a sensor hub or a small motor-control interface.

WLCSP package — footprint and assembly notes

The 25-ball WLCSP (0.4 mm pitch typical for this class) is a direct-attach, no-underfill package that saves board space but demands careful PCB layout — fine traces, via-in-pad capability, and a solder-mask-defined pad. The supplier device package is 25-WLCSP; the package / case is also listed as 25-UFBGA. This is not a hand-solderable part; it requires a reflow oven and stencil.

Frequently asked questions

What package does the STM32L031E4Y6TR use?

The STM32L031E4Y6TR is supplied in a 25-ball WLCSP (wafer-level chip-scale package), also described as a 25-UFBGA. It is a surface-mount, fine-pitch package designed for reflow assembly.

Can STM32L031E4Y6TR replace STM32L031E4Y6?

The STM32L031E4Y6TR is the Tape & Reel (TR) packaged variant of the base STM32L031E4Y6 device. The die and electrical specifications are identical; the difference is the shipping medium. The TR suffix indicates reel packaging for automated pick-and-place. They are functionally interchangeable.