The STM32H7B3ZIT6Q: It comes in a 144-pin LQFP package — a standard QFP footprint that is hand-solderable and reworkable without hot air.
Memory headroom — 2 MB Flash, 1.4 MB RAM
With 2 MB of Flash and 1.4 MB of RAM, this MCU can hold complex firmware, a graphics framebuffer for a small LCD, or a data-logging buffer without external memory. The RAM is generous enough for dual-bank OTA updates or audio processing pipelines. If your application needs more than 1.4 MB of working memory, you will need an external SDRAM or SRAM — the EBI/EMI interface supports that.
Package and rework — 144-LQFP, no BGA fuss
The 144-LQFP package (20x20 mm body) is a standard QFP with 0.5 mm pitch. It is reworkable with a basic soldering iron and flux — no BGA reball or hot-air station required. The leads are visible for inspection, which helps in field repairs or low-volume assembly. MSL 3 out of the bag per the STM32H7 family; bake before reflow if the moisture barrier bag has been open past the floor-life window.
The base product number is STM32H7B3, and the series is STM32H7, so future density or package variants are available if your BOM needs to scale.