The STM32H7B3ZIT6Q: It comes in a 144-pin LQFP package — a standard QFP footprint that is hand-solderable and reworkable without hot air.
Memory headroom — 2 MB Flash, 1.4 MB RAM
With 2 MB of Flash and 1.4 MB of RAM, this MCU can hold complex firmware, a graphics framebuffer for a small LCD, or a data-logging buffer without external memory. The RAM is generous enough for dual-bank OTA updates or audio processing pipelines.
Package and rework — 144-LQFP, no BGA fuss
It is reworkable with a basic soldering iron and flux — no BGA reball or hot-air station required. The leads are visible for inspection, which helps in field repairs or low-volume assembly.
The base product number is STM32H7B3, and the series is STM32H7, so future density or package variants are available if your BOM needs to scale.