The STM32H7B3NIH6Q: ARM Cortex-M7 MCU at 280 MHz with 1.4 MB RAM.
If you are supporting a production line that already qualifies this BGA footprint, the immediate task is to secure enough devices for the remaining build horizon.
216-ball BGA — layout and assembly notes
The 216-TFBGA package (13x13 mm) is a fine-pitch BGA — not a hand-solderable part. The board requires a multilayer stack-up with microvias or blind vias to route the 116 I/O and the supply rails. Operating temperature covers -40 to 85 °C, so the assembly must survive industrial reflow profiles.
