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STMicroelectronics STM32H7B3NIH6Q — Microcontrollers & Processors (MCU / MPU / DSP)
STMicroelectronics

STM32H7B3NIH6Q ARM Cortex-M7 MCU, 280 MHz, 2 MB Flash

MPNSTM32H7B3NIH6Q
Obsolete

STMicroelectronics STM32H7 series, ARM Cortex-M7 32-bit MCU, 280 MHz, 2 MB Flash, 1.4 MB RAM, 116 I/O, 216-TFBGA, -40 to 85 °C.

$55.9900Ref. price · indicative, final on quote
STM32H7B3NIH6Q datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

STM32H7B3NIH6Q Technical Specifications
ParameterValue
SeriesSTM32H7
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.62V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed280MHz
PackageTray
RAM size1.4M x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCamera, CANbus, EBI/EMI, HDMI-CEC, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, PSSI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Number of i (O)116
Core processorARM® Cortex®-M7
Case216-TFBGA
Data convertersA/D 20x16b; D/A 3x12b
Program memory size2MB (2M x 8)

Product details

The STM32H7B3NIH6Q: ARM Cortex-M7 MCU at 280 MHz with 1.4 MB RAM.

Obsolete — what that means for procurement

STMicroelectronics has marked the STM32H7B3NIH6Q as Obsolete. If you are supporting a production line that already qualifies this BGA footprint, the immediate task is to secure enough devices for the remaining build horizon.

216-ball BGA — layout and assembly notes

The 216-TFBGA package (13x13 mm) is a fine-pitch BGA — not a hand-solderable part. The board requires a multilayer stack-up with microvias or blind vias to route the 116 I/O and the supply rails. Operating temperature covers -40 to 85 °C, so the assembly must survive industrial reflow profiles. MSL is not stated in this record, but BGA packages typically ship at MSL 3; if the moisture-barrier bag has been open past the floor-life window, a bake before reflow is mandatory to avoid popcorning.

Frequently asked questions

Is STM32H7B3NIH6Q obsolete?

Buyers need to know if the part is end-of-life to avoid design or supply chain risks.

What is the alternative for STM32H7B3NIH6Q?

Finding a drop-in replacement or equivalent is critical when the original is obsolete or unavailable.

Where can I buy STM32H7B3NIH6Q?

Sourcing buyers need to locate authorized distributors with stock or lead time information.

What is the datasheet for STM32H7B3NIH6Q?

Design engineers validate pin compatibility, electrical characteristics, and design-in requirements from the official datasheet.

What is the price of STM32H7B3NIH6Q?

Pricing information is essential for BOM cost analysis and procurement decisions.

Is STM32H7B3NIH6Q in stock anywhere?

Real-time inventory visibility prevents production delays and expedites purchasing for both small and large volumes.