The STM32H7A3NIH6Q: The 216-ball TFBGA package (13x13 mm) provides 166 general-purpose I/O lines.
Connectivity and peripheral set — what is on-chip
The EBI/EMI bus supports external memory or FPGA glue logic. HDMI-CEC, IrDA, LINbus, MDIO, and SWPMI round out the connectivity for industrial, consumer, and telecom applications. On-chip data converters include 20-channel 16-bit ADC and three 12-bit DAC channels.
Obsolete — sourcing through independent distribution
The STM32H7A3NIH6Q carries an Obsolete lifecycle status.
Package and temperature grade — design-in notes
The 216-TFBGA (13x13 mm) is a fine-pitch BGA requiring controlled reflow profiling and X-ray inspection post-solder. Supply voltage spans 1.62 V to 3.6 V.