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STMicroelectronics STM32G0B1KET6 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32G0B1KET6 32-bit ARM Cortex-M0+ MCU, 64 MHz

MPNSTM32G0B1KET6
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STMicroelectronics STM32G0B1KET6, ARM Cortex-M0+ 32-bit MCU, 64 MHz, 512 KB Flash, 144 KB SRAM, USB/CAN/I²C/SPI, 13x12b ADC, 2x12b DAC, -40°C to 85°C, 32-LQFP.

$6.5900Ref. price · indicative, final on quote
Packaging32-LQFP
SeriesSTM32G0
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32G0B1KET6 specifications
ParameterValue
SeriesSTM32G0
MountingSurface Mount
Oscillator typeExternal, Internal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed64MHz
PackageTray
RAM size144K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, HDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART, USB
Number of i (O)30
Core processorARM® Cortex®-M0+
Case32-LQFP
Data convertersA/D 13x12b SAR; D/A 2x12b
Program memory size512KB (512K x 8)

Product details

The STMicroelectronics STM32G0B1KET6 is a mainstream 32-bit ARM Cortex-M0+ microcontroller running at 64 MHz, packing 512 KB of Flash and 144 KB of SRAM.

512 KB Flash / 144 KB SRAM — firmware headroom and data buffering

With 512 KB of Flash you can hold a full application stack plus a bootloader and OTA staging area. The 144 KB SRAM is generous for a Cortex-M0+ part — enough for double-buffered USB packets, a CAN message queue, and a moderate RTOS heap. If your firmware footprint fits under 256 KB, the STM32G0B1KET6 still gives you headroom for future feature adds without a die shrink.

Analog and connectivity peripherals

The 13-channel 12-bit SAR ADC and dual 12-bit DAC reduce external analog front-end components for sensor conditioning or closed-loop control. The brown-out detect and POR circuits are on-chip, saving an external supervisor.

32-LQFP package — rework and layout considerations

The 32-LQFP (7x7 mm) package is a standard fine-pitch gull-wing that reflows cleanly with a hot-air station and is hand-solderable for prototypes. No hidden thermal pad means you don't need via stitching under the part — just a standard top-side copper pour if you want to sink heat from the die.

This means no last-time-buy window looming, no end-of-life notice in the near term.

Frequently asked questions

Where to buy STM32G0B1KET6?

Buyers need a reliable source to purchase the exact component for production or prototyping.

What is the price of STM32G0B1KET6?

Price directly impacts BOM cost, and buyers compare across distributors to minimize expenses.

Is STM32G0B1KET6 obsolete?

Lifecycle status determines long-term availability and design viability; obsolete parts require redesign.

What are the alternatives to STM32G0B1KET6?

Engineers need drop-in replacements for design flexibility or sourcing issues.

What is the pinout of STM32G0B1KET6?

Pin compatibility is critical for PCB layout and design validation.

What is the lead time for STM32G0B1KET6?

Lead time affects production scheduling and supply chain planning.