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STMicroelectronics STM32G031G6U6TR — Microcontrollers & Processors (MCU / MPU / DSP)

STM32G031G6U6TR ARM Cortex-M0+ MCU, 64 MHz, 32 KB Flash

MPNSTM32G031G6U6TR
Active

ST STM32G0 series, STM32G031G6U6TR, ARM Cortex-M0+ 32-bit MCU, 64 MHz, 32 KB Flash, 8 KB SRAM, 26 I/O, 28-UFQFPN, -40 to 85°C, Tape & Reel.

$1.4830Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

STM32G031G6U6TR specifications
ParameterValue
SeriesSTM32G0
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed64MHz
PackageTape & Reel (TR)
RAM size8K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)26
Core processorARM® Cortex®-M0+
Case28-UFQFN
Data convertersA/D 17x12b
Program memory size32KB (32K x 8)

Product details

64 MHz Cortex-M0+ — what it buys you

The STM32G031G6U6TR is an STM32G0-series 32-bit MCU built around the ARM Cortex-M0+ core, clocked at 64 MHz. That core speed is the practical ceiling for deterministic control loops — think sensor polling at tens of kilohertz, real-time I²C/SPI transactions, or a small state-machine RTOS. The 32 KB Flash (32K x 8) and 8 KB SRAM (8K x 8) are sized for single-purpose firmware: a BLDC motor controller, a temperature/humidity data logger, or a LIN-bus node in an automotive subassembly.

28-UFQFPN — footprint and thermal reality

The 26 I/O count covers a typical UART + I²C + SPI + a handful of PWM channels.

Industrial temperature, built-in peripherals

The 17-channel 12-bit ADC handles multi-sensor analog front ends without an external mux.

Frequently asked questions

Is STM32G031G6U6TR pin-compatible with the STM32G031G6?

Yes, the base part number STM32G031 covers both variants; the G6U6 suffix indicates the 28-UFQFPN package and Tape & Reel packing. The G6 (non-TR) shares the same die and pad layout — the difference is only the shipping medium.